MANUFACTURE OF SURFACE RELIEF STRUCTURES
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Oct 30, 2024
filing date -
Oct 30, 2024
priority date (Note) -
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Abstract
A method and apparatus for the etching of variable depth features in a substrate is described. Movement of the substrate relative to an etchant (e.g. into or out of the etchant) during the etching process is utilised to provide a varying etch time, and hence depth, across the substrate, and in various examples this is enabled without requiring a varying mask.
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