Importance

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Abstract

A flexible circuit board and a method for fabricating the same are provided. The flexible circuit board includes an insulation substrate with two trenches on its two opposite end surfaces separately. A signal wire is disposed in the insulation substrate, and thus the insulation substrate surrounds the signal wire. Two flexible circuit substrates are separately located on two opposite surfaces of the insulation substrate, and each flexible circuit substrate includes a conductive layer and a power layer. The conductive layer is extended from one surface to end surfaces of the insulation substrate, and then is extended to the trenches along the end surfaces. The power layer is located between the conductive layer and the insulation substrate and is electrically connected to the conductive layer. In each trench, one conductive layer is connected to the other conductive layer, and two conductive layers are electrically connected to each other.

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First Claim