PRINTED WIRING BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Jul 31, 2024
filing date -
Jul 31, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer includes resin and inorganic particles including first particles and second particles such that the first particles have flat exposed portions, the second particles are embedded in the resin, and the surface of the resin insulating layer includes the resin and the flat exposed portions of the first particles.
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Family
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Cited Art Landscape
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