HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Aug 6, 2024
filing date -
Aug 6, 2024
priority date (Note) -
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Abstract
A high-integration carrier plate and a manufacturing method thereof are disclosed. The carrier plate is configured for a power supply module, the carrier plate includes at least one hollowed-out area, an inductance element is arranged in the hollowed-out area, the inductance element comprises a magnetic core and a winding penetrating through the magnetic core, at least one part of a side wall of the hollowed-out area is provided with a side wall metal piece, the at least one side wall metal piece is used for being electrically connected with one electrostatic potential end of the power supply module, and the inductance element is fixedly connected with the side wall of the hollowed-out area through an insulating bonding medium layer.
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