ELECTRONIC DEVICE INCLUDING INTERPOSER

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250056723A1
SERIAL NO

18928679

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic device is provided. The electronic device includes a housing forming an exterior of at least part of the electronic device, a battery disposed to an inner space of the electronic device formed by the housing, and a printed board assembly (PBA) disposed between the battery and a side member of the housing in the inner space, the PBA including a first printed circuit board (PCB), a second PCB, and an interposer PCB disposed between the first PCB and the second PCB to connect the first PCB and the second PCB, wherein the interposer PCB includes an insulating layer which includes a first face and a second face opposite to the first face, a first via group which penetrates the insulating layer to connect the first face and the second face, and includes a plurality of first vias formed spaced apart from each other, the plurality of first vias included in the first via group being used as a first transmission path through which a first signal passes, a first conductive pad which is disposed on the first face to cover first holes of the plurality of first vias, formed on the first face, and is electrically coupled to the plurality of first vias, and a first solder layer which is disposed on the first conductive pad, wherein the first conductive pad extends by a first width in a first direction along the first face of the insulating layer, and wherein the first solder layer extends by a second width smaller than the first width in the first direction.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHUNG, Myungkyoon Suwon-si, KR 11 9
PARK, Dohyeong Suwon-si, KR 4 10
PARK, Junghoon Suwon-si, KR 91 625

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