FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE TRANSPARENT WIRING BOARD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250056728A1
SERIAL NO

18738547

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Abstract

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Provided is a flexible transparent wiring board which includes a base substrate, and wiring, in which the base substrate is transparent and has flexibility and insulating properties, a groove is formed on an upper surface of the base substrate, the wiring is formed of a wiring constituent material filled in the groove, and the groove is formed in a narrow V-shape in a depth direction.

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Patent Owner(s)

Patent OwnerAddress
MEKTEC CORPORATION12-15 SHIBA-DAIMON 1-CHOME MINATO-KU TOKYO 105-8585

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BUSHIMATA, Masahiro Tokyo, JP 1 0
NAKAMURA, Akihiro Tokyo, JP 200 1969

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