Housing Assembly, Housing Assembly Preparation Method, and Electronic Device
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Oct 29, 2024
filing date -
Oct 29, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A housing assembly includes a substrate, where the substrate includes a first surface and a second surface that are opposite to each other, the first surface of the substrate is close to an electronic device, and the substrate is formed through hot-pressing after glass fiber cloth is soaked in an epoxy resin adhesive solution; a first decoration layer, disposed on the first surface of the substrate; a light shielding layer, disposed on a surface that is of the first decoration layer and that is away from the substrate; and a second decoration layer, disposed on the second surface of the substrate. Therefore, the substrate uses a glass fiber epoxy resin plate, which is a light and thin material, and is high in strength, modulus, and transparency.
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Family
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Cited Art Landscape
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