INSULATING FILM POLISHING SOLUTION AND USAGE METHOD THEREOF
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Dec 23, 2022
filing date -
Dec 23, 2022
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Abstract
The present disclosure provides an insulating film polishing solution, comprising: cerium oxide, an anionic polymer, a cationic polymer, an insulating film inhibitor, and water, wherein the pattern polishing rate of the polishing rate of the insulating film polishing solution is more than 5 times that of non-pattern polishing rate. The insulation film polishing solution in the present invention has good stability and can realize an automatic stop function.
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