TESTING MODULE
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Oct 9, 2024
filing date -
Oct 9, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A testing module includes a wafer and a probe head. The wafer includes a scribe line and a probe pad. The scribe line extends along a direction. The probe pad is disposed on the scribe line. The probe pad includes a first metal layer, a dielectric layer, and a second metal layer. The dielectric layer is disposed on the first metal layer, in which the dielectric layer includes a first recess. The second metal layer is configured to connect to the first metal layer, in which the second metal layer includes a first portion and a second portion. The first portion includes a trench exposing the dielectric layer, and the second portion is disposed on the first recess and a top surface of the dielectric layer to form a first via. The probe head includes multiple probe needles.
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