COIL DEVICE AND PRINTED WIRING BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Dec 22, 2022
filing date -
Dec 22, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
The coil device includes a plurality of printed wiring boards and an adhesive layer. The plurality of printed wiring boards are stacked in a thickness direction of the coil device. Each of the plurality of printed wiring boards includes a base film having a first main surface and a second main surface, and a coil wire formed in a spiral shape on at least one of the first main surface and the second main surface. The adhesive layer is disposed between the plurality of printed wiring boards adjacent to each other in the thickness direction of the coil device. The coil device has a portion that satisfies expression (1).
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