SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250062116A1
SERIAL NO

18722502

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Abstract

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A substrate processing apparatus with a support part that has a substrate-facing surface and supports the substrate in a state of being spaced from the substrate-facing surface. The support part is accommodated into a processing space of a processing chamber. A processing fluid flows in a certain direction in the processing space. In a path for a laminar flow of the processing fluid between the substrate and the support part, a downstream path positioned on a downstream side in the certain direction is wider than an upstream path positioned on an upstream side in the certain direction to reduce the pressure loss of the processing fluid flowing from the upstream path to the downstream path to prevent re-adhesion of the liquid to the substrate.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ANDO, Koji Kyoto, JP 123 1804
INABA, Masaki Kyoto, JP 52 356
MOTONO, Tomohiro Kyoto, JP 5 0
SHIRAKAWA, Hajime Kyoto, JP 4 20
SUMI, Noritake Kyoto, JP 23 4

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