PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Nov 1, 2024
filing date -
Nov 1, 2024
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Abstract
A plasma processing method according to the present disclosure includes a preparing a substrate having a first etching film and a mask on the first etching film, the mask including a metal-containing film; and generating plasma in a chamber with a processing gas including one or both of a chlorine-containing gas and a bromine-containing gas to etch the first etching film.
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