WAFER CLEANING APPARATUS AND METHOD OF CONTROLLING THE SAME
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Nov 6, 2024
filing date -
Nov 6, 2024
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Abstract
A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.
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