TEMPERATURE REGULATION OF INTEGRATED CIRCUIT ELEMENTS
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Aug 14, 2023
filing date -
Aug 14, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package, comprising: a substrate; an analog circuitry that is formed on the substrate; a first heating element that is formed on the substrate; a first temperature sensing element that is formed on the substrate; a first heating control circuitry that is formed on the substrate, the first heating control circuitry being configured to detect whether a first temperature measurement that is taken with the first temperature sensing element is below a first threshold, and turn on the first heating element in response to detecting that the first temperature measurement is below the first threshold, the first heating element being turned on only when the first temperature measurement is below the first threshold; and an encapsulating material configured to encapsulate the substrate, the analog circuitry, the first temperature sensing element, the first heating element, and the first heating control circuitry.
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