PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Feb 20, 2025
app pub date -
Dec 21, 2022
filing date -
Dec 21, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A printed wiring board includes: a dielectric layer having a main surface; and a conductive pattern. The conductive pattern includes a metal layer that is disposed on the main surface, an electroless plating layer that is disposed on the metal layer, and an electrolytic plating layer that is disposed on the electroless plating layer. An average thickness of the metal layer is 2.1 μm or more and 9.0 μm or less. Maximum height roughness of a surface of the metal layer opposed to the main surface is 5.0 μm or less.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully