METHOD FOR MANUFACTURING CIRCUIT BOARD

United States of America

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Issued Date
Feb 20, 2025
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Dec 5, 2022
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Dec 5, 2022

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Abstract

Present embodiment relates to a method for manufacturing a circuit board, and more specifically, to a technique for solving problems that may arise due to etching by injecting epoxy or silicon or inserting a metal block into a gap formed between two or more ceramic substrates.

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Patent Owner(s)

Patent Owner	Address
LX SEMICON CO LTD	222 TECHNO 2-RO YUSEONG-GU DAEJEON 34027 34027

International Classification(s)

H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
CHO, Nam Tae	Daejeon, KR	2	0
LEE, Jun Ho	Daejeon, KR	216	965

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METHOD FOR MANUFACTURING CIRCUIT BOARD

Number of patents in Portfolio can not be more than 2000

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