MASK-SUPPORT ASSEMBLY AND PRODUCING METHOD THEREOF
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Dec 21, 2023
filing date -
Dec 21, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a mask-support assembly and a producing method thereof. The mask-support assembly according to the present invention is used in a process of forming organic light emitting diode (OLED) pixels on a semiconductor wafer, and may include a support including an edge portion and a grid portion; and a mask connected onto the support and including a plurality of cell portions with mask patterns formed therein, wherein at least a part of the mask is disposed in a trench portion recessed in the support.
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