SLURRY SOLUTION, METHOD FOR FABRICATING THE SLURRY SOLUTION, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SLURRY SOLUTION
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Apr 19, 2024
filing date -
Apr 19, 2024
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Abstract
A slurry solution includes an abrasive including a first frame portion including an oxide and having a spherical shape, a plurality of pores in the abrasive, and a plurality of first abrasive elements at least partially filling the plurality of pores, where the plurality of first abrasive elements include Ce(OH)4.
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