ELECTRIC WIRES AND CABLES FOR SPACE APPLICATIONS
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Apr 11, 2022
filing date -
Apr 11, 2022
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Abstract
The present invention relates to a process for manufacturing a silver-plated copper or a copper alloy blank wire, having a silver layer thickness of 1.5 μm to 15 μm, comprising the step of electrolytically depositing silver on the copper or copper alloy blank wire, said electrolytic deposition being performed at a pulsating current with reversal in a silver-plating bath under particular electrolytic conditions. It also relates to the silver-plated copper or copper alloy blank wire obtainable by said process, a process for manufacturing a silver-plated copper or copper alloy strand, the strand obtainable by said process, a silver-plated conductor and an electromagnetic shielding layer comprising the silver-plated strand, an electric wire comprising the silver-plated conductor and an electric cable comprising the electric wire and uses thereof.
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