SENSING ELEMENT AND RELATED METHODS
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Nov 20, 2024
filing date -
Nov 20, 2024
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Abstract
An apparatus includes a first acoustic sensing resonator formed from a silicon substrate and has a first microelectromechanical system. The apparatus also includes a second acoustic sensing resonator formed from the silicon substrate and has a second microelectromechanical system. The second acoustic sensing resonator is arranged on the silicon substrate at a ninety degree (90°) angle with respect to the first acoustic sensing resonator and together the first acoustic sensing resonator and second acoustic sensing resonator form a torque sensor. A high temperature bonding surface is connected to the torque sensor for directly connecting the torque sensor to a metal object.
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