SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

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United States of America

APP PUB NO 20250079152A1
SERIAL NO

18679553

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Abstract

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In a substrate processing method and substrate processing, a preliminary organic solvent supply processing is performed between a chemical processing and a rinse processing. After the rinse processing, a replacement processing using an organic solvent and a liquid fill processing (liquid film formation processing) is performed to form a liquid film. The rinse liquid remains not on the inner bottom surface of the pattern, but at a position sandwiched by two types of liquid layers in a vertical direction. The rinse liquid comprising a remaining liquid diffuses with those liquid layers and becomes a so-called remaining liquid-free state. Under that state, a dry processing by the processing fluid in the supercritical state is performed.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDTENJINKITA-MACHI 1-1 TERANOUCHI-AGARU 4-CHOME HORIKAWA-DORI KAMIGYO-KU KYOTO-SHI KYOTO 602-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SUMI, Noritake Kyoto, JP 23 4

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