Importance

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Abstract

In a substrate processing method and a substrate processing device, a processing fluid is dissolved into a liquid film which is formed on a substrate. A surface tension of the liquid film decreases in a pressure boosting period during which the pressure is boosted by supplying the processing fluid to a processing chamber. Therefore, part of the liquid film flows down from the substrate and the liquid film is thinned to a certain extent. Here, a reduction amount of the film thickness drastically increases by applying the vibration to the substrate in the pressure boosting period, and film thinning is promoted. Thereafter, the processing fluid in the supercritical state contacts the thinned liquid film, whereby the substrate is dried.

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First Claim