MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Aug 30, 2023
filing date -
Aug 30, 2023
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Abstract
Magnetic inductors for microelectronics packages are provided. Magnetic inductive structures include a magnetic region, a magnetic region base region, and a conductive region that forms a channel within the magnetic region. The magnetic region has a different chemical composition than the base region. Additional structures are provided in which the magnetic region is recessed into a package substrate core. Further inductor structures are provided in which the conductive region includes through-core vias and the conductive region at least partially encircles a portion of a package substrate core. Additionally, methods of manufacture are provided for semiconductor packages that include magnetic inductors.
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