Importance

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Abstract

A wiring board includes a first wiring structure and a second wiring structure. The first wiring structure includes: a mounting surface for a semiconductor element; and a back surface on an opposite side of the mounting surface. The second wiring structure is formed on the back surface of the first wiring structure. The first wiring structure further includes thin film layers, a cavity, an electronic component, and a filling resin layer. The thin film layers include laminated wiring layers and laminated insulating layers. The cavity is formed by cutting out at least one of the insulating layers of the thin film layers in a direction toward the mounting surface. The electronic component is located in the cavity. The filling resin layer fills the cavity, and further covers the electronic component.

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First Claim