Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing Method
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Apr 25, 2023
filing date -
Apr 25, 2023
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Abstract
A component carrier including: i) a stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure; ii) a first metal trace comprising a rough surface; and iii) a second metal trace arranged adjacent to the first metal trace, comprising a smooth surface. The component carrier is configured to guide high-frequency and or high-speed signals through the second metal trace.
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