Method and Apparatus of Conductive Hybrid Material Layer Stacks with Magnetic Material
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Oct 30, 2024
filing date -
Oct 30, 2024
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Abstract
Presented herein is the apparatus and method of stacking magnetic materials with hybrid conductive materials. These methods and apparatus can be used in the formation of PCBs but are not limited to the formation of PCBs. The layer stacks presented within have a layer of conductive hybrid material and at least one layer of magnetic material. In at least one exemplary embodiment, these layers are adjacent in a layer stack, and the magnetic layer is a magnetic hybrid material.
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