SECURE ELECTRONIC COMPONENT ASSEMBLY
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Sep 5, 2023
filing date -
Sep 5, 2023
priority date (Note) -
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Abstract
A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and an underfill material disposed between the IC and the PCB. The underfill material comprises a detection agent that is configured to change a state of the IC in response to exposure to an external environment, wherein the change in the state of the IC is indicative of a tamper condition.
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