SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Sep 4, 2024
filing date -
Sep 4, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a semiconductor package cutting system including a cutting device for partial-cutting at least a portion of a strip including a plurality of semiconductor packages, an inspection device mounted behind the cutting device to supply a first strip to be cut to the cutting device and to receive and inspect a second strip cut by the cutting device, and a storage device mounted behind the inspection device to supply the first strip stored therein, to the inspection device and to receive and store the second strip inspected by the inspection device, wherein the inspection device includes an inspection table for placing the first or second strip thereon and moving the first strip along a first direction.
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