CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Sep 11, 2024
filing date -
Sep 11, 2024
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Abstract
Provided are a curable maleimide resin composition that can avoid the usage of a problematic solvent, such as NMP among aprotic polar solvents, having a high boiling point and toxicity, can be cured at a relatively low temperature, and provide a cured product having a superior adhesiveness to semiconductor materials. The curable maleimide resin composition contains:
- (A) a maleimide compound that has a number average molecular weight of 5,000 to 50,000;(B) a reaction initiator; and(C) a silane coupling agent that has one or more epoxy groups in one molecule; and optionally(D) a diaminotriazine ring-containing imidazole.
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