Importance

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Abstract

A thermal conductive silicone composition including: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 100,000 mm²/s and not containing an alkoxysilyl group; (B) an organopolysiloxane containing an alkoxysilyl group; (C) one or more thermal conductive fillers selected from irregular-shaped, round, and polyhedral fillers having a thermal conductivity of 10 W/m·K or more; and (D) hydrophobic spherical silica particles having a D₅₀ in a range of 0.005 to 1 μm and a D₉₀/D₁₀ of 3 or less in a volume-based particle size distribution and having an average circularity of 0.8 to 1, wherein an amount of the component (C) is 40 to 85% by volume of the entire thermal conductive silicone composition.

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First Claim