UV-CURABLE PUTTY COMPOSITION FOR COVERING, FILLING, AND REPAIRING SUBSTRATE DEFECTS
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Jul 29, 2022
filing date -
Jul 29, 2022
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Abstract
A radiation curable putty composition and a method for repairing a defect in a substrate with such composition are provided. The radiation curable putty composition comprises about 6-50 wt % of a UV curable oligomer, about 4-25 wt % of a non-reactive oligomer, about 5-30 wt % of a UV reactive monomer, an extender, about 3-10 wt % of fumed silica, a polyhydroxycarboxylic acid amide, and about 3-6 wt % of photoinitiators, said photoinitiators comprising a surface-cure photoinitiator and a through-cure photoinitiator, and wherein the putty composition has a solids content of about 99 wt % or greater.
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