MOLYBDENUM CHEMICAL MECHANICAL POLISHING COMPOUNDS AND METHODS OF USE THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250084280A1
SERIAL NO

18818832

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Abstract

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The present disclosure relates to chemical mechanical polishing (CMP) compositions comprising a first and second molybdenum static etching rate suppressor, an anionic silica abrasive, and an oxidizer.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATEDNISHIKASUGAI-GUN AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Onishi, Shogo Tualatin, US 42 88
Whitener, Glenn Tualatin, US 16 123

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