SLURRY AND POLISHING METHOD

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United States of America

APP PUB NO 20250084294A1
SERIAL NO

18960483

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Abstract

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A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the second particles contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and a ratio of the lowest valence among the plurality of valences of the metal is 0.10 or more in X-ray photoelectron spectroscopy.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HASEGAWA, Tomoyasu Tokyo, JP 23 106
IWANO, Tomohiro Tokyo, JP 56 332
KUKITA, Tomomi Tokyo, JP 20 24
MATSUMOTO, Takaaki Tokyo, JP 30 156
NOMURA, Satoyuki Tokyo, JP 32 307

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