HIGH STRENGTH ALUMINIUM ALLOYS CONTAINING SILICON AND COPPER FOR USE IN ADDITIVE MANUFACTURING AND METHOD OF USING THE SAME
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Sep 10, 2024
filing date -
Sep 10, 2024
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Abstract
The present disclosure describes an alloy which achieves a level of densification of 99.5% or greater and a method of making the same, wherein the method may include (a) depositing a first layer of a precursor powder including aluminum, silicon, and copper onto a build platform, (b) contacting the first layer of the precursor powder with an energy source to form a solid layer, (c) depositing a subsequent layer of the precursor powder on top of the solid layer, (d) contacting the subsequent layer of the precursor powder with the energy source to fuse the subsequent layer of the precursor powder to the solid layer, thereby forming the three-dimensional article.
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