FLOW STABILITY CONTROL IN DRYING LIQUID BETWEEN PLATES
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Aug 24, 2023
filing date -
Aug 24, 2023
priority date (Note) -
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Abstract
A method of flow control is provided. The method includes injecting a liquid onto a wafer via a dispense system. The dispense system includes a plate and an injection hole in the plate. The plate is positioned away from the wafer at a distance and has a diameter equal to or larger than the wafer. A drying gas is injected onto the wafer via the dispense system to push out the liquid. While injecting the drying gas onto the wafer via the dispense system, at least one parameter selected from the group consisting of an inlet flow pressure of the injection hole, the distance and an injection sequence is adjusted so that an interface between the drying gas and the liquid is stable.
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