Importance

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Abstract

A method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. A short to ground connection is added for every back-drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. Failed back-drills may be detected in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost-effective repair and guarantees back-drill failures do not pass into the field.

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First Claim