MULTILAYER ELECTRONIC COMPONENT
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Jun 13, 2024
filing date -
Jun 13, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A multilayer electronic component includes a body including a capacitance formation portion that is a region a dielectric layer and internal electrodes alternately arranged with the dielectric layer interposed therebetween in a first direction and including first and second surfaces opposing each other in the first direction, and external electrodes disposed on the body. The body further includes cover portions disposed on one side and the other surface of the capacitance formation portion in the first direction. A surface of one of the cover portions includes a flat portion forming the first surface or the second surface, a protrusion protruding from the first surface or the second surface in the first direction, and a recess portion concave from the first surface or the second surface in the first direction. One end of the protrusion is spaced apart from the recess portion and is disposed on the recess portion.
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