SEMICONDUCTOR MANUFACTURING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250087526A1
SERIAL NO

18437119

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Abstract

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A semiconductor manufacturing apparatus according to the present embodiment includes a stage configured to support a semiconductor wafer. A probe card is positioned above the stage. A first electrode is formed of a conductive material, is movable on the stage from an outer side of the stage toward a center, and is contactable with a side surface of the semiconductor wafer.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA72 HORIKAWA-CHO SAIWAI-KU KAWASAKI-SHI KANAGAWA-KEN
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HASEBE, Shun Nonoichi Ishikawa, JP 1 0

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