HYBRID PRINTED CIRCUIT BOARD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250089166A1
SERIAL NO

18774603

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A hybrid printed circuit board includes: an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole configured to accommodate a surface mount device; and an adhesive member comprising an adhesive material provided between the insulating substrate and the printed circuit board.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI-DO 16677

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIM, Keonwoo Suwon-si, KR 46 222
KIM, Moonyoung Suwon-si, KR 35 27
KO, Junyoung Suwon-si, KR 30 69
LEE, Jinhyung Suwon-si, KR 42 243
SEO, Kangmoon Suwon-si, KR 5 1

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