Importance

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Abstract

A wiring substrate includes an insulating layer having through holes, a first conductor layer, a second conductor layer, interlayer conductors formed in the through holes. The interlayer conductors are connecting the first and second conductor layers and include first interlayer conductors formed in first region of the insulating layer and second interlayer conductors formed in second region of the insulating layer at density higher than density of the first interlayer conductors formed in the first region. A thickness of each first interlayer conductor is larger than a thickness of each second interlayer conductor. The insulating layer is formed such that the through holes includes first through holes having the first interlayer conductors formed therein and second through holes having the second interlayer conductors formed therein and that an inner diameter of each of the first through holes is larger than an inner diameter of each of the second through holes.

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First Claim