PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
May 23, 2024
filing date -
May 23, 2024
priority date (Note) -
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Abstract
The present disclosure relates to a printed circuit board including a first insulating layer, a pad disposed on an upper side of the first insulating layer, a protrusion disposed on the pad; and a metal post disposed on the pad and covering the protrusion, wherein the metal post has a tapered shape, such that a width of an upper surface of the metal post is smaller than a width of a lower surface of the metal post, and a method of manufacturing the printed circuit board.
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