CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Nov 29, 2023
filing date -
Nov 29, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board structure is provided. The circuit board structure includes a substrate, a solder mask coupler, a supporter, and a chip. The substrate has a conductive structure. The solder mask coupler is disposed on the substrate. The supporter contacts the solder mask coupler, and the supporter is fixed on the substrate via the solder mask coupler. The chip is disposed on the substrate, and the chip is electrically connected with the conductive structure.
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