CLEANING APPARATUS FOR A WIRE CLAMP CONFIGURED TO CLAMP A WIRE USED IN A WIRE BONDING PROCESS AND CLEANING SYSTEM INCLUDING THE CLEANING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250091096A1
SERIAL NO

18610940

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Abstract

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A cleaning apparatus for a wire clamp includes: a cleaner that cleans the wire clamp that clamps a wire; a supplying roller that supplies a cleaning tape to the cleaner; a first guide roller that applies a tension to the cleaning tape that is supplied from the supplying roller to the cleaner; a collecting roller that collects the cleaning tape, which cleans the wire clamp, from the cleaner; and a second guide roller that applies a tension to the cleaning tape that is collected from the cleaner by the collecting roller.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIM, Junsuk Suwon-si, KR 1 0

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