SUBSTRATE PROCESSING APPARATUS USING SUPERCRITICAL FLUID AND DRIVING METHOD THEREOF

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United States of America

APP PUB NO 20250091101A1
SERIAL NO

18627651

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Abstract

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A substrate processing apparatus includes a reactor having a processing space formed therein, a fluid supply unit supplying a supercritical fluid into the processing space of the reactor, and a controller controlling the reactor and the fluid supply unit. The controller controls, in response to whether a state of the supercritical fluid supplied to the reactor satisfies a set condition, the reactor and the fluid supply unit to perform one of cleaning of the processing space by using the supercritical fluid and drying of a substrate seated in the processing space by using the supercritical fluid.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, Kun Tack Suwon-si, KR 27 38
PARK, Ji Hwan Suwon-si, KR 69 145
PARK, Sang Jine Suwon-si, KR 10 67

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