THERMALLY CONDUCTIVE SHEET AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250092207A1
SERIAL NO

18727520

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Abstract

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A thermally conductive sheet comprising a matrix formed of an organic polymer, and a fibrous filler, wherein a thickness of the thermally conductive sheet is less than 200 μm, the fibrous filler is oriented in a thickness direction of the thermally conductive sheet, and a ratio (D50/T) of an average fiber length D50 of the fibrous filler to the thickness of the thermally conductive sheet (T) is less than 0.58.

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Patent Owner(s)

Patent OwnerAddress
SEKISUI POLYMATECH CO LTDSAITAMA-CITY SAITAMA 338-0837

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IWAZAKI, Hiromichi Saitama-shi, Saitama, JP 4 1
KUDOH, Hiroki Saitama-shi, Saitama, JP 18 15
KUROO, Kenta Saitama-shi, Saitama, JP 4 1

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