THERMALLY CONDUCTIVE SILICONE COMPOSITION
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Jul 5, 2024
filing date -
Jul 5, 2024
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Abstract
A thermally conductive silicone composition includes a thermally conductive filler that includes: a silicon carbide having a peak of the particle size distribution in the range of from 10 to 40 μm; a first thermally conductive filler having a thermal conductivity of 10 to 300 W/mK and having a peak of the particle size distribution in the range of from 0.1 to 1.0 μm; a second thermally conductive filler having a thermal conductivity of 10 to 300 W/mK and having a peak of the particle size distribution in the range of from more than 1.0 to less than 10 μm; and a third thermally conductive filler (exclusive of silicon carbide) having a thermal conductivity of 60 to 300 W/mK and having a peak of the particle size distribution in the range of from 10 to 40 μm.
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