ELECTRODEPOSITED COPPER FOIL WITH A UNIFORM MATTE SURFACE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250092553A1
SERIAL NO

18779551

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention discloses an electrodeposited copper foil with a uniform matte surface. The electrodeposited copper foil of the present invention has an average thickness (TAve) of about 30 μm to about 400 μm; and the matte surface of the present electrodeposited copper foil has a uniformity factor (UF) of 5.5 μm or less.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DUPONT ELECTRONICS INC974 CENTRE ROAD WILMINGTON DE 19805

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIN, SHIH-CHING HSINCHU, TW 11 4
LIN, YA-MEI HSINCHU, TW 3 5

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation