BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME
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United States of America
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Mar 20, 2025
app pub date -
Dec 4, 2024
filing date -
Dec 4, 2024
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Abstract
A bonded body according to an embodiment includes a nitride ceramic member, and a metal member bonded with the nitride ceramic member via a bonding layer. A titanium nitride layer that includes titanium nitride as a major component is formed at a nitride ceramic member and the interface between the bonding layer. The titanium nitride layer includes a location at which an oxygen amount is not less than 1 at %.
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