MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Sep 19, 2023
filing date -
Sep 19, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
Mitigating fiber weave effect, including obtaining a laminate sheet, the laminate sheet including a fiber weave of fibers; obtaining a cut laminate sheet from the laminate sheet, the laminate sheet including a first side and a second side opposite to the first side, the obtaining including: marking multiple cutting line between the first side and the second side of the laminate sheet positioning a printed circuit board (PCB) design image in superimposition with the cut laminate sheet; rotating the cut laminate sheet such that each of the sides of the cut laminate sheet are aligned with a respective side of the PCB design image; and forming the PCB on the cut laminate sheet based on the rotation of the cut laminate sheet with respect to the PCB design image and the alignment between the cut laminate sheet and the PCB design image.
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