SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20250100023A1
SERIAL NO

18890972

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A solvent supply unit of a substrate processing device is disposed at a position higher than an opening of an upper surface of a processing tank, and supplies a mist-like solvent from an outside of the processing tank toward an inside of the processing tank in plan view. When a substrate is immersed in processing liquid, a control unit performs a solvent supply operation of decompressing an inside of the chamber and supplying the mist-like solvent from the solvent supply unit. In a solvent supply state in which the inside of the chamber is decompressed and the solvent is supplied, the control unit causes a lifter to take out the substrate from the processing liquid in the processing tank, and then opens a QDR valve to discharge the processing liquid from the processing tank. In the solvent supply state, the control unit causes the lifter to lower the substrate to a lower position in the processing tank in which the processing liquid is not stored, and then causes the lifter to raise the substrate.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDKYOTO JAPAN KYOTO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKIYAMA, Takashi Kyoto-shi, JP 186 1988
ITO, Akira Kyoto-shi, JP 521 5667
IWATA, Keiji Kyoto-shi, JP 35 192
NAGAI, Yasuhiko Kyoto-shi, JP 26 854
YAMAMOTO, Shigeru Kyoto-shi, JP 196 2415

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